Acoustic resonators for microphones

ABSTRACT

Aspects of the subject technology relate to electronic devices having microphones. An electronic device may include a microphone and a resonator for the microphone. The resonator may be formed in a device structure that is spatially separated from the microphone. The resonator may be formed in an interior wall of a housing of the electronic device, or in a support structure within an enclosure of the electronic device. A resonator and/or one or more damping features, may reduce a resonance effect, on the microphone, of a resonant cavity within the enclosure of the electronic device and adjacent the microphone.

TECHNICAL FIELD

The present description relates generally to aspects of audiotransducers for electronic devices, including, for example, acousticresonators for microphones for electronic devices.

BACKGROUND

Electronic devices such as computers, media players, cellulartelephones, wearable devices, and headphones are often provided withspeakers for generating audio output from the device and microphones forreceiving audio input to the device. However, as devices are implementedin ever smaller form factors, it can be challenging to integratemicrophones into electronic devices, particularly in compact devicessuch as portable electronic devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Certain features of the subject technology are set forth in the appendedclaims. However, for purpose of explanation, several aspects of thesubject technology are set forth in the following figures.

FIG. 1 illustrates a perspective view of an example electronic devicehaving a microphone in accordance with various aspects of the subjecttechnology.

FIG. 2 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone and a cavity that is opento the external environment in accordance with various aspects of thesubject technology.

FIG. 3 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone and a closed cavity inaccordance with various aspects of the subject technology.

FIG. 4 illustrates a schematic cross-sectional top view of a portion ofan electronic device having a microphone and cavity in accordance withvarious aspects of the subject technology.

FIG. 5 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone and a cavity that is atleast partially filled with a damping material in accordance withvarious aspects of the subject technology.

FIG. 6 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone and a cavity that is atleast partially filled with another example damping material inaccordance with various aspects of the subject technology.

FIG. 7 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone and a cavity that is atleast partially filled with yet another example damping material inaccordance with various aspects of the subject technology.

FIG. 8 illustrates a top view of a portion of an electronic device witha structural feature for preventing formation of a resonant cavity inaccordance with various aspects of the subject technology.

FIG. 9 illustrates a schematic diagram of an example resonator coupledto a cavity of an electronic device for improving the performance of amicrophone in accordance with various aspects of the subject technology.

FIG. 10 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone, a cavity, and a resonatorfor the microphone in a housing of the electronic device in accordancewith various aspects of the subject technology.

FIG. 11 illustrates a cross-sectional side view of a portion of anexample electronic device having a microphone, a cavity, and a resonatorfor the microphone in an internal structure of the electronic device inaccordance with various aspects of the subject technology.

FIG. 12 illustrates a schematic diagram of multiple resonators coupledto a cavity of an electronic device for improving the performance of amicrophone at multiple frequencies in accordance with various aspects ofthe subject technology.

FIG. 13 illustrates a schematic diagram of multiple resonators coupledto a cavity of an electronic device for providing improving theperformance of a microphone at multiple modes of standing wave inaccordance with various aspects of the subject technology.

FIG. 14 illustrates a schematic diagram of a resonator coupled to ablocked cavity of an electronic device for providing improving theperformance of a microphone in accordance with various aspects of thesubject technology.

FIG. 15 illustrates an electronic system with which one or moreimplementations of the subject technology may be implemented.

DETAILED DESCRIPTION

The detailed description set forth below is intended as a description ofvarious configurations of the subject technology and is not intended torepresent the only configurations in which the subject technology may bepracticed. The appended drawings are incorporated herein and constitutea part of the detailed description. The detailed description includesspecific details for the purpose of providing a thorough understandingof the subject technology. However, it will be clear and apparent tothose skilled in the art that the subject technology is not limited tothe specific details set forth herein and may be practiced without thesespecific details. In some instances, well-known structures andcomponents are shown in block diagram form in order to avoid obscuringthe concepts of the subject technology.

Portable electronic devices such as a mobile phones, portable musicplayers, tablet computers, laptop computers, wearable devices such assmart watches, headphones, earbuds, other wearable devices, and the likeoften include one or more audio transducers such as a microphone forreceiving sound input, or a speaker for generating sound.

However, challenges can arise when constraints for spatial integrationwith other device components, and/or other constraints compete withaudio quality constraints when attempting to implement an audiotransducer module (e.g., a microphone or a microphone module) in anelectronic device. These challenges can be particularly difficult whenattempting to implement a microphone into a compact device such as aportable or a wearable device. For example, resonance effects within aresonant cavity within a housing of an electronic device at or near amicrophone within the housing can disrupt or suppress audio inputs tothe microphone at one or more resonant frequencies of the resonantcavity. As an example, a resonant cavity can be unintentionally formedwhen a gap between adjacent housing components of an electronic devicebecomes closed, such as due to a shift of one housing component towardanother housing component, or due to accumulation of debris in the gap.

In accordance with aspects of the subject disclosure, various featuresare provided that may ameliorate a resonance effect of a resonant cavitywithin the housing of an electronic device adjacent to a microphone ofthe electronic device, and thereby improve the performance of themicrophone. In one or more implementations, a housing component may beprovided with a modified edge to prevent closure of the gap. In one ormore implementations, a portion of the resonant cavity may be at leastpartially filled with a damping material such as: a protrusion orextension on an interior structure of the electronic device, an additivematerial such as a foam within the cavity, or a thickening of a housingsidewall. In one or more implementations, a resonator, such as aHelmholtz resonator, may be provided in a device structure separate fromthe microphone. As examples, a Helmholtz resonator can be formed in aninternal plastic structure, or in a housing sidewall. As discussed infurther detail hereinafter, in some implementations, multiple resonatorscan be provided in an electronic device, to ameliorate resonances atmultiple resonant frequencies and/or multiple modes of a resonantfrequency.

An illustrative electronic device including a microphone is shown inFIG. 1 . In the example of FIG. 1 , electronic device 100 has beenimplemented using a housing that is sufficiently small to be portableand carried by a user (e.g., electronic device 100 of FIG. 1 may be ahandheld electronic device such as a tablet computer or a cellulartelephone or smart phone). As shown in FIG. 1 , electronic device 100includes a display such as display 110 mounted on the front of housing106. Electronic device 100 includes one or more input/output devicessuch as a touch screen incorporated into display 110, a button or switchsuch as button 104 and/or other input output components disposed on orbehind display 110 or on or behind other portions of housing 106.Display 110 and/or housing 106 include one or more openings toaccommodate button 104, a speaker, a light source, or a camera.

In the example of FIG. 1 , housing 106 includes two openings 108 on abottom sidewall of housing 106. One or more of openings 108 forms a portfor an audio component. For example, one of openings 108 may form aspeaker port for a speaker disposed within housing 106 and another oneof openings 108 may form a microphone port for a microphone disposedwithin housing 106. Openings 108 may be open ports or may be completelyor partially covered with a permeable membrane or a mesh structure thatallows air and sound to pass through the openings. Although two openings108 are shown in FIG. 1 , this is merely illustrative. One opening 108,two openings 108, or more than two openings 108 may be provided on thebottom sidewall (as shown) on another sidewall (e.g., a top, left, orright sidewall), on a rear surface of housing 106 and/or a front surfaceof housing 106 or display 110. In some implementations, one or moregroups of openings 108 in housing 106 may be aligned with a single portof an audio component within housing 106. Housing 106, which maysometimes be referred to as a case, may be formed of plastic, glass,ceramics, fiber composites, metal (e.g., stainless steel, aluminum,etc.), other suitable materials, or a combination of any two or more ofthese materials.

The configuration of electronic device 100 of FIG. 1 is merelyillustrative. In other implementations, electronic device 100 may be acomputer such as a computer that is integrated into a display such as acomputer monitor, a laptop computer, a wearable device such as a smartwatch, a pendant device, or other wearable or miniature device, a mediaplayer, a gaming device, a navigation device, a computer monitor, atelevision, a headphone, an earbud, or other electronic equipment.

In some implementations, electronic device 100 may be provided in theform of a wearable device such as a smart watch. In one or moreimplementations, housing 106 may include one or more interfaces formechanically coupling housing 106 to a strap or other structure forsecuring housing 106 to a wearer. Electronic device 100 may include one,two, three, or more than three audio components each mounted adjacent toone or more of openings 108.

In the example of FIG. 1 , display 110 includes a transparent outerlayer 112 (e.g., a glass layer or a transparent plastic layer) that,along with the housing 106, forms an enclosure for the electronic device100. As shown, the transparent outer layer 112 may include one or moreopenings such as opening 114. Opening 114 may form a port for an audiocomponent. For example, opening 114 may form a microphone port for amicrophone 116 disposed within the enclosure formed by the housing 106the transparent outer layer 112. Opening 114 may be an open port or maybe completely or partially covered with a permeable membrane and/or amesh structure that allows air and sound to pass through the opening114.

In the example of FIG. 1 , the microphone 116 is offset from the opening114. For example, the microphone 116 may be acoustically coupled to theopening 114 via an acoustic duct within the enclosure of electronicdevice 100 and extending between the opening 114 and the microphone 116.In one or more implementations, the acoustic duct that is configured toallow sound generated externally to the electronic device 100 to reachthe microphone 116 may also be acoustically coupled to one or morecavities within the enclosure formed by the housing 106 and thetransparent outer layer 112. In one or more implementations, theelectronic device 100 may include a gap 118 between the housing 106 andthe transparent outer layer 112. For example, the gap 118 may have a gapwidth of less than one millimeter (mm), less than 0.5 mm, less than 0.2mm, less than 0.1 mm, or between zero and one hundred microns. As shownin FIG. 1 , the enclosure formed by the housing 106 and the transparentouter layer 112 may include a one or more straight portions, such asstraight portion 120, and one or more curved portions, such as curvedportions 122.

FIG. 2 illustrates a cross-sectional side view of a portion of theelectronic device 100 in the vicinity of a cavity within the enclosureformed by the housing 106 and the transparent outer layer 112. As shownin FIG. 2 , a cavity 208 within the enclosure formed by the housing 106and the transparent outer layer 112 may be defined, in part, by aportion (e.g., an interior wall 214) of the housing 106, in part by aportion of the transparent outer layer 112, and in part by internalstructures (e.g., a surface 216) of the electronic device 100.

In the example of FIG. 2 , the internal structures that define a portionof the cavity 208 include components of a display module 200. As shown,the display module 200 may include the transparent outer layer 112, adisplay layer 202 (e.g., including display components such as displaypixels and/or control circuitry for the display pixels), a supportstructure 204 (e.g., a molded support structure such as a molded plasticsupport structure), and a support structure 206 (e.g., a metal supportstructure). In this example, the support structure 204 is overmoldedonto the support structure 206. In other examples, the support structure204 may be attached to the support structure 206 by other attachmentmechanisms or methods (e.g., adhesives, screws, clamps, press fit,etc.). In one or more implementations, the support structure 206 mayform portion of a ground plane for the display module, and may also forma part of an antenna system of the electronic device 100, in one or moreimplementations.

In the example of FIG. 2 , the cavity 208 may be defined, in part, by asurface 216 of the support structure 204, and, in part, by an interiorwall 214 of the housing 106. In one or more implementations, the cavity208 may be fluidly and/or acoustically coupled to an acoustic ductbetween the opening 114 and the microphone 116 of FIG. 2 . In theexample of FIG. 2 , the gap 118 is an air gap between an edge 210 of thetransparent outer layer 112, and an edge 212 of the housing 106. In thearrangement shown in FIG. 2 , in a use case in which sound that hasentered the opening 114 and is travelling through an acoustic duct tothe microphone 116 leaks into the cavity 208, the leaked sound can leakback out of the cavity 208 through the gap 118. In this configuration,the operation of the microphone may be unaffected by sound leakage intothe cavity 208.

However, as illustrated in FIG. 3 , in some implementations, one or moreportions of the gap 118 may become closed. For example, in some usescases, the transparent outer layer 112 and/or the display module 200 mayslide (e.g., due to an external pressure or force on the transparentouter layer, a replacement or repair of the display module 200, or in adrop event of the electronic device) toward the edge 212 of the housing106, moving the edge 210 of the transparent outer layer 112 into contactwith the edge 212 of the housing 106. In another example, over time, amaterial 300, such as debris (e.g., oil, dust, dirt, etc.) from theexternal environment, may become lodged in the gap 118, thereby closingthe gap 118, as in the example of FIG. 3 .

In a use case in which the gap 118 becomes closed, the cavity 208 maybecome a resonant cavity within the housing 106 (e.g., within theenclosure formed by the housing 106 and the transparent outer layer112). The resonant cavity formed by the closure of a portion of thecavity 208 may have resonant properties that negatively affect theoperation of the microphone 116.

For example, FIG. 4 illustrates a top view of a portion of theelectronic device 100 including the portion of the electronic device 100of FIG. 3 , in which the material 300 has closed a portion of the gap118. In this example, the gap 118 includes a closed portion 403 and anopen portion 404. In the example of FIG. 3 , the closed portion 403 ofthe gap 118 is caused by the material 300 that has closed the closedportion 403 of the gap 118. However, it is also appreciated that theclosed portion 403 of the gap 118 may be formed by a portion of thetransparent outer layer 112 that has moved into contact with the housing106 to close the closed portion 403 of the gap 118. In these examples,the open portion 404 of the gap 118 may be a portion of the gap 118 thathas not been filled with material 300 and/or not been closed by contactbetween the edge 210 of the transparent outer layer 112 and the edge 212of the housing 106. In this example, a portion of the cavity 208 that isclosed by the closed portion 403 of the gap 118 may form a closed cavity(e.g., a trapped and/or resonant cavity) within the housing 106 (e.g.,within the enclosure formed by the housing 106 and the transparent outerlayer 112). In this example, another portion of the cavity 208 that isopen to the external environment via the open portion 404 of the gap 118may be an open cavity within the housing 106 (e.g., an open cavity thatextends from a distal end of the closed cavity).

As shown in the example of FIG. 4 , the microphone 116 may include afront volume 409 and a back volume 411. The front volume may be fluidlyand acoustically coupled (e.g., via an acoustic duct 406) to the opening114 in the transparent outer layer 112 (e.g., a cover glass layer orcover glass). In one or more implementations, the acoustic duct 406 maybe formed by a microphone housing 400 of a microphone module 401 inwhich the microphone 116 is disposed. In one or more otherimplementations, the acoustic duct 406 may be formed, entirely or inpart, by one or more other device structures that guide sound thatpasses through the opening 114 to the microphone 116. In one or moreimplementations, the cavity 208 may be fluidly and/or acousticallycoupled to the acoustic duct 406.

As illustrated in FIG. 4 , a closed portion of a cavity within theenclosure of the electronic device 100 (e.g., a closed portion of thecavity 208 of FIG. 3 ) formed in part by the closed portion 403 of thegap 118 may form a resonant cavity 402 (which is represented externallyto the electronic device 100 and enlarged in FIG. 3 for clarity of thediscussion, and which may also be referred to herein as a trapped cavityor a standing wave tube in various examples) within the housing 106(e.g., within the enclosure formed by the housing 106 and thetransparent outer layer 112). For example, the size and length of thecavity 208 may allow a standing wave of wavelength, λ, to be generatedtherein. As indicated in FIG. 4 , the wavelength, λ, of the standingwave may be twice the length of the resonant cavity 402. In other words,the resonant cavity 402 may have a length of λ/2. The resonant cavitymay also have resonant frequencies of, for example, f=c/(N*λ/2), where cis the speed of sound and N is an integer 1, 2, 3, etc. As discussed infurther detail hereinafter, a resonant cavity 402 (e.g., formed by aportion of the cavity 208 that is defined in part by the closed portion404 of the gap 118 and forms a standing wave tube) may generate apressure null at the microphone 216 which can cause an undesirable dipin the frequency response of the microphone 116. In one or moreimplementations, a microphone module 401 mounted within the housingadjacent the opening may include an actuatable sound-generatingcomponent 415 (e.g., a diaphragm) that is offset from the opening 114 inthe transparent outer layer 112. As illustrated in FIGS. 2-4 , in one ormore implementations, the resonant cavity 402 may run along an interiorwall 214 of the housing 106 in a direction away from the opening 114,from a proximal end 420 adjacent the microphone module 401 to a distalend 422.

In one or more implementations, the distal end 422 of the resonantcavity 402 may be defined by a location at which the gap 118 opens, andsound thus is able to leak out of the cavity 208 into the externalenvironment through the open portion 404 of the gap (e.g., as in theexample of FIG. 4 ). In some examples, the location at which the gap 118opens may be a location at which no more debris is disposed in theopening. In other examples, the location at which the gap 118 opens maybe a location at which the housing 106 and/or the transparent outerlayer 112 curve such that the housing 106 and the transparent outerlayer 112 curve away from a straight portion 120 of the enclosure inwhich the housing 106 and the transparent outer layer 112 are incontact. In one or more implementations, the distal end 422 may coincidewith the location at which the straight portion 120 interfaces with thecurved portion 122.

In one or more implementations, the microphone module 401 may be mountedadjacent a straight portion 120 of the enclosure formed by the housing106 and the transparent outer layer 112, and the resonant cavity 402 mayrun along the interior wall 214 to a curved portion 122 of the enclosureformed by the housing 106 and the transparent outer layer 112. In one orimplementations, the cavity 208 may include a portion that is an opencavity (e.g., open to the external environment via the open portion 404of FIG. 4 ) that runs along the interior wall 214 of the curved portion122 of the housing 106 and that is fluidly coupled to the resonantcavity 402 (e.g., fluidly coupled to a closed portion of the cavity 208that is closed, in part, by the closed portion 403 of FIG. 4 ) at alocation within the enclosure and fluidly coupled to an externalenvironment of the electronic device 100 via the gap 118 between thetransparent outer layer 112 and the housing 106.

In accordance with aspects of the subject disclosure, an electronicdevice such as the electronic device 100 may be provided with variousfeatures that may reduce or prevent the negative effect on a microphonesuch as microphone 116, of a resonant cavity that may form within ahousing of the electronic device. For example, in one or moreimplementations, one or more damping features may be provided adjacentto and/or within at least a portion of the cavity, to damp an acousticresonance of the cavity. In one or more implementations, the electronicdevice 100 may be provided with one or more structural features thatprevent the formation of a resonant cavity within the enclosure thereof.In one or more implementations, one or more additional resonances may beintroduced to ameliorate the resonance effect of a resonant cavity on amicrophone such as microphone 116.

For example, FIG. 5 illustrates an exemplary implementation in which theelectronic device 100 is provided with a damping feature that includesdamping material 500 within at least a portion of the cavity 208. Forexample, the damping material 500 may be an acoustic foam formed in aportion of the cavity. In one or more implementations, the dampingmaterial 500 may reduce a width of the cavity 208 and provide a broaddamping of the resonance of the cavity 208 by narrowing the cavity. Inone or more implementations, the damping material may be injected intothe cavity 208 after the enclosure formed by the housing 106 and thetransparent outer layer 112 is assembled.

FIG. 6 illustrates another exemplary implementation in which theelectronic device 100 is provided with a damping feature that includesdamping material 600 within at least a portion of the cavity 208. In theexample of FIG. 6 , the damping material 600 is formed by an extensionmember on an interior component (e.g., the support structure 204) of theelectronic device 100. In this example, the damping material 600 may bea plastic material that is integrally formed with, or attached to thesupport structure 204, to form the extension member extending into thecavity 208. In this example, the extension member formed by the dampingmaterial 600 narrows the width of the cavity 208 and may provide abroadband damping of the resonant features of the cavity 208.

FIG. 7 illustrates another exemplary implementation in which theelectronic device 100 is provided with a damping feature that includesdamping material 700 within at least a portion of the cavity 208. In theexample of FIG. 7 , the damping material 700 is formed by a thickenedportion of the housing 106. In this example, the damping material 700may be a metal, plastic, glass, or other material that is common to thematerial of the housing and that is integrally formed with and/orattached to the interior wall 214 of the housing 106. In this example,the thickening of the housing 106 formed by the damping material 700narrows the width of the cavity 208 and may provide a broadband dampingof the resonant features of the cavity 208.

In one or more implementations, instead of, or in addition to, providinga damping material within the cavity 208, the electronic device 100 maybe provided with a structural feature that helps to prevent the gap 118from closing to form a resonant cavity within the housing 106. Forexample, FIG. 8 illustrates an example implementation in which the edge210 of the transparent outer layer 112 is a patterned edge. In theexample of FIG. 8 , the patterned edge of the transparent outer layer112 is a curved edge that includes peaks 800 and valleys 802. In thisexample, if the transparent outer layer 112 is moved (e.g., slides orslips) toward the housing 106, the peaks 800 may contact the edge 212 ofthe housing 106, leaving a remaining portion of the gap 118 adjacent thevalleys 802 to remain open to allow sound to leak from the cavity 208below (e.g., by keeping cavity 208 fluidly coupled to the externalenvironment of the electronic device 100 via a gap between the valleys802 and the edge 212 of the housing). In this way, the resonant cavitymay be prevented from forming. Although a smoothly curved patterned edgeof the transparent outer layer 112 is shown in FIG. 8 , it is alsoappreciated that other patterns can be provided on the edge 210 of thetransparent outer layer 112 and/or on the edge 210 of the housing 106,to prevent closing of the gap 118, in various implementations.

In one or more implementations, instead of, or in addition to, providinga damping material within the cavity 208, and/or providing a patternededge of the transparent outer layer 112 and/or the housing 106 (as inthe examples of FIGS. 5-8 ), the electronic device 100 may include aresonator for the microphone 116. In this way, an additional resonancemay be introduced that ameliorates a resonance of a portion of thecavity 208 that may become closed.

For example, FIG. 9 illustrates an example of a resonator 900 that maybe fluidly coupled to the resonant cavity 402 (e.g., and, via the cavity208, to the front volume 409 of the microphone 116). As illustrated inFIG. 9 , the resonant cavity 402 (e.g., formed by a closed portion ofthe cavity 208) may generate a standing wave having a wavelength, λ,that is twice a distance between the proximal end 420 and the distal end422 of the cavity, and the standing wave may cause velocity peaks andpressure nulls at the ends of the resonant cavity 402. In this example,the resonator 900 is configured to modify a resonance of the resonantcavity 402 (e.g., by modifying and/or reducing the standing wave withinthe cavity) at a target frequency that corresponds to a wavelength ofλ/2, and the resonator 900 is located at a quarter wavelength locationof the standing wave (e.g., at a location that is a distance λ/4 fromthe proximal end 420). At this location (e.g., a peak pressurelocation), the pressure generated by standing wave within the resonantcavity 402 may have a maximum pressure, which may be modified and/orreduced by the resonator 900 at that location.

In the example of FIG. 9 , the resonator 900 is a Helmholtz resonatorhaving an acoustic compliance portion 902 (e.g., a neck) and an acousticmass portion 904 (e.g., a chamber) coupled between the acousticcompliance portion 902 and the resonant cavity 402. In the example ofFIG. 9 , the electronic device 100 also include an acoustic mesh 906that spans across the acoustic mass portion 904 of the resonator 900. Invarious implementations, the acoustic mesh 906 may be disposed at one orthe other end of the acoustic mass portion 904, or at a location betweenthe ends of the acoustic mass portion 904, and may substantially spanthe cross-sectional area of acoustic mass portion 904. The acoustic mesh906 may be a mesh which exhibits loss with respect to velocity, and maybe disposed across the acoustic mass portion 904, as velocity is thehighest in the acoustic mass of the Helmholtz resonator. In one or moreimplementations, in addition to, or instead of, the acoustic mesh 906,the resonator 900 may be provided with a damping material in theacoustic compliance portion 902. For example, a damping material in theacoustic compliance portion 902 may provide damping in terms of pressureloss in addition to, or instead of, damping in terms of velocity loss bythe acoustic mesh 906 (e.g., as, at the resonance, a peak pressure mayoccur in the acoustic compliance portion 902 and a peak velocity mayoccur in the acoustic mass portion 904).

In one or more implementations, the resonator 900 for the microphone 116is disposed at a location spatially separated from the microphone 116.For example, the resonator 900 may be formed in the housing 106 or aninterior structure (e.g., the support structure 204 of the electronicdevice 100. For example FIG. 10 illustrates an example in which theresonator 900 is formed in the housing 106 (e.g., in the interior wall214 of the housing 106). In this example, the resonator 900 (e.g.,including the acoustic mass portion 904 and the acoustic complianceportion 902) may be machined directly into, or otherwise formed in, theinterior wall 214 of the housing 106. In this example, the resonator 900may be disposed at a location within the housing 106 that is spatiallyseparated from the microphone module 401. For example, the resonator 900may be disposed at location (e.g., a peak pressure location, such as aquarter wavelength location) between the proximal end 420 and the distalend 422 of the resonant cavity 402. For example, the peak pressurelocation or quarter wavelength location may be at a midpoint of theresonant cavity 402 (e.g., midway between the proximal end 420 and thedistal end 422). It is also appreciated that, when the electronic device100 is manufactured, the resonator 900 in the housing 106 may be fluidlycoupled to the cavity 208 at a location adjacent an open portion 404 ofthe gap 118. In this way, the resonator 900 may be positioned in thehousing 106 to damp the resonant characteristics of the cavity 208 at afuture time when the gap 118, or a portion thereof, becomes closedand/or blocked.

FIG. 11 illustrates another example implementation, in which theresonator 900 is formed in the support structure 204 of the displaymodule 200. In this example, the resonator 900 (e.g., including theacoustic mass portion 904 and the acoustic compliance portion 902) maybe formed, for example, by overmolding the support structure 204 on asacrificial material having the shape of the resonator 900, and removingthe sacrificial material to form the resonator 900. In this example, theresonator 900 may be disposed at a location within the support structure204 that is spatially separated from the microphone module 401. Forexample, the resonator 900 may be disposed in the support structure 204at location (e.g., a peak pressure location such as a quarter wavelengthlocation) between the proximal end 420 and the distal end 422 of theresonant cavity 402. It is also appreciated that, when the electronicdevice 100 is manufactured, the resonator 900 in the support structure204 may be fluidly coupled to the cavity 208 at a location adjacent anopen portion 404 of the gap 118. In this way, the resonator 900 may bepositioned in the support structure 204 at the time of manufacturing todamp the resonant characteristics of the cavity 208 at a future timewhen the gap 118, or a portion thereof, becomes closed and/or blocked.

As discussed herein in connection with various examples, in some usecases, a closure of a portion of the gap 118 that creates a resonantcavity portion of the cavity 208 can occur due to device-to-devicemanufacturing variations, or (after manufacturing) due to an accidentaldrop of the electronic device 100, an external pressure or force on theelectronic device 100, a replacement or repair of a component such asdisplay module 200 or a portion thereof, and/or due to buildup of debrisin the gap 118 over time. For this reason, the length of a resonantcavity within an electronic device such as electronic device 100 maydiffer from device to device, and/or may change over time. For thisreason, the length and/or resonant characteristics of the resonantcavity portion of cavity 208 at any given time, may be unknown at thetime of manufacture of the electronic device. In one or moreimplementations, an electronic device such as the electronic device 100may include multiple resonators for the microphone 116. For example, themultiple resonators may be sized and arranged to provide targetedmodification and/or reduction of standing waves of variouswavelengths/frequencies (e.g., in resonant cavities having variousrespective lengths).

For example, FIG. 12 illustrates an example in which the electronicdevice 100 includes the resonator 900 configured to modify and/or reducethe resonant characteristics of the resonant cavity 402, and anadditional resonator 1200 configured to modify and/or reduce theresonant characteristics of a relatively longer resonant cavity, such asresonant cavity 1203. For example, in one illustrative use case, theresonant cavity 402 may be formed when a portion of the transparentouter layer 112 slides into contact with a portion of the housing 106and closes a corresponding portion of the gap 118, the portion having alength that defines the length of the resonant cavity 402. In thisexample use case, over time, another portion of the gap 118 that was notclosed when the portion of the transparent outer layer 112 slid intocontact with the portion of the housing 106 may become closed (e.g., bybecoming filled with debris or due to a further sliding of thetransparent outer layer 112), thereby elongating the resonant cavity(e.g., the closed portion of the cavity 208) to form the resonant cavity1203. For example, the resonant cavity 1203 may be formed by extendingthe distal end of a closed portion of the cavity 208 to the distal end1220 of the resonant cavity 1203.

As shown, the resonant cavity 402 that is defined at least in part bythe device housing and that extends from the proximal end 420 (adjacentthe microphone 116) to the distal end 422 (spatially separated from themicrophone 116) may have the resonator 900 fluidly coupled thereto, at aquarter wavelength location of the resonant cavity 402 (e.g., at amidpoint of the resonant cavity 402, such as at a distance A/2 from theproximal end 420 of a resonant cavity having a length A, which may behalf of the wavelength λ of a standing wave in the resonant cavity 402).As shown, the resonant cavity 402 extends from the proximal end 420,past the resonator 900, to the distal end 422. However, if the resonantcavity 402 is extended to form the resonant cavity 1203 (e.g., having alength B), the resonator 900 may no longer be effective to modify and/orreduce the resonant characteristics of the cavity. However, in thisexample use case, resonator 1200 for the microphone 116 may be disposedat an additional location between the location of the resonator 900 andthe distal end of the cavity. Because the resonant cavity 1203 is longerthan the resonant cavity 402, the resonant cavity 1203 may generatestanding waves (e.g., having a wavelength 2B) that is longer than thewavelength λ (e.g., 2A) of the standing waves of the resonant cavity402. As shown in FIG. 12 , the resonator 1200 may be located at aquarter wavelength location of a standing wave in the resonant cavity1203 (e.g., at a midpoint of the resonant cavity 1203 such as at adistance B/2 from the proximal end 420). As shown, the resonator 1200may also be a Helmholtz resonator, and may include an acoustic massportion 1204 and an acoustic compliance portion 1202. As shown, theresonator 1200 may also include an acoustic mesh 1206 disposed acrossthe acoustic mass portion 1204 within or at an end of the acoustic massportion 1204. The resonator 1200 may also, or alternatively, include adamping material in the acoustic compliance portion 1202 in one or moreimplementations.

As shown in FIG. 12 , the resonator 1200 may have an acoustic complianceportion 1202 (e.g., a chamber) and an acoustic mass portion 1204 (e.g.,a neck) that extends from the resonant cavity 1203 to the acousticcompliance portion 1202. As shown, in addition to being disposed furtherfrom the microphone module 401 (e.g., at the proximal end 420), theacoustic mass portion 1204 of the resonator 900 may be relatively longerthan the acoustic mass portion 904 of the resonator 900, and theacoustic compliance portion 1202 of the resonator 1200 may be relativelylarger in volume than the volume of the acoustic compliance portion 902of the resonator 900 (e.g., to tune the resonator 1200 to the wavelength2B of the resonant cavity 1203). As shown in FIG. 12 , the resonator1200 may be provided with an acoustic mesh 1206 that spans the acousticmass portion 1204. In various implementations, the acoustic mesh 1206may be disposed across the acoustic mass portion 1204 at the end of theacoustic mass portion 1204 that interfaces with the resonant cavity1203, at an opposing end of the acoustic mass portion 1204 thatinterfaces with the acoustic compliance portion 1202, or at anintermediate location between the ends of the acoustic mass portion1204.

In the example of FIG. 12 , the electronic device 100 is provided withtwo resonators (resonator 900 and resonator 1200) to modify and/orreduce the resonant characteristics of two resonant cavities withdifferent lengths. In other implementations, more than two resonatorscan be disposed along the cavity 208 to provide modification and/orreduction of resonance effects for resonant cavities of more than twodifferent lengths, and/or or two or more resonators can be disposedalong the cavity to provide damping for multiple modes (e.g., N=1, 2, 3,etc.) of a single resonant cavity.

For example, FIG. 13 illustrates an example in which two resonators 900are coupled to the resonant cavity 402 to modify and/or reduce theeffects of multiple modes of a standing wave having the wavelength λ. Inthe example of FIG. 13 , the electronic device 100 includes theresonator 900 at a first peak pressure location at thequarter-wavelength position at which the pressure in the resonant cavity402 peaks, and an additional resonator 900 for the microphone at anadditional peak pressure location between the location of the resonatorand the distal end of the resonant cavity 402 (e.g., at a location atwhich the pressure in the resonant cavity 402 is a maximum negativepressure). For example, the resonator 900 nearest the proximal end 420may be configured to modify a resonance of a first mode of the standingwave having the wavelength λ, and the resonator 900 may be located at aquarter wavelength location of the standing wave (e.g., at a distance ofone quarter of the wavelength λ from the proximal end 420). In theexample of FIG. 13 , the electronic device 100 also includes a secondresonator 900 at a three-quarter wavelength location of standing wavehaving the wavelength λ (e.g., at a distance of three-quarters ofwavelength λ from the proximal end 420). In one or more implementations,the resonator 900 at the three-quarter wavelength location may bedisposed (e.g., within an interior component such as the supportstructure 204, or in the housing 106) in the curved portion 122 of theenclosure of the electronic device 100.

In the examples of FIGS. 4-13 , the resonant cavity 402 (e.g., and theresonant cavity 1203) may have a length that is defined by a locationalong the cavity 208 at which a closed portion 403 of the gap 118 ends,and beyond which the gap 118 is open. In one or more other examples, thelength of a resonant cavity formed by the cavity 208 may be defined by abarrier (e.g., a physical barrier) at the distal end of the cavity. Forexample, FIG. 14 illustrates an example in which a resonant cavity 1402(e.g., formed by a portion of the cavity 208 along which the gap 118 isclosed) extends from a proximal end 1404 (e.g., adjacent the microphone116) to a barrier 1400 (e.g., a physical barrier such as a wall) at adistal end 1406. In this example, barrier 1400 closes the resonantcavity 1402 at the distal end 1406. In this example, the resonator 900is configured to modify a resonance of a standing wave having awavelength, λ, that is four times a distance between the proximal end1404 and the distal end 1406 of the resonant cavity 1402. In thisexample, resonator 900 is located, adjacent the barrier 1400, at aquarter wavelength location of the standing wave (e.g., at a distance ofone quarter of the wavelength λ from the proximal end 1404).

In accordance with one or more implementations, a device such as theelectronic device 100 may include a microphone 116, having a frontvolume 409 and a back volume 411, and a resonator 900 for the microphone116, the resonator 900 fluidly coupled to the front volume 409 of themicrophone 116 (e.g., as described herein in connection with FIG. 4 ).As described herein, in one or more implementations, the resonator 900may be a Helmholtz resonator (e.g., a Helmholtz resonator that includesa neck, such as the acoustic mass portion 904, and a chamber, such asthe acoustic compliance portion 902). As discussed herein, theelectronic device 100 may also include an acoustic mesh 906 that spans aneck (e.g., the acoustic mass portion 904) of the Helmholtz resonator.In one or more implementations, the electronic device 100 may include acavity (e.g., cavity 208 and/or a resonant cavity 402 formed from aportion of the cavity 208) defined at least in part by a device housing(e.g., housing 106) of the electronic device 100, the cavity 208extending from a proximal end 420 adjacent the microphone 116 to adistal end 422 spatially separated from the microphone 116. Theresonator 900 may be fluidly coupled to the cavity. In one or moreimplementations, the electronic device 100 may also include a deviceenclosure (e.g., formed, at least in part, by the housing 106 and thetransparent outer layer 112) having an opening 114 for the microphone116. The microphone 116 may include a diaphragm (e.g., the actuatablesound-generating component 415) that is laterally offset from theopening 114 in the device enclosure (e.g., as shown in FIG. 4 ).

In accordance with one or more implementations, a device such as theelectronic device 100 may include a device enclosure (e.g., formed, atleast in part, by the housing 106 and the transparent outer layer 112),an acoustic component (e.g., microphone 116) disposed within the devicehousing, and a resonator 900 for the acoustic component, the resonatorformed in the device housing at a location that is spatially separatedfrom the acoustic component. For example, the acoustic component mayinclude a microphone 116 configured to receive sound through an opening114 in the device enclosure from an external environment of the device.In one or more implementations described herein, the electronic devicemay also include a cavity (e.g., cavity 208 and/or a resonant cavity 402formed by a portion of the cavity 208) defined at least in part by thedevice enclosure and extending from a proximal end 420 adjacent themicrophone 116 to a distal end 422 spatially separated from themicrophone 116, the resonator 900 being fluidly coupled to the cavity.As discussed in connection with various examples herein (e.g., inconnection with FIGS. 4, 9, 12 , and/or 13), the cavity may extend fromthe proximal end 420, past the resonator 900, to the distal end 422. Asdiscussed in connection with, for example, FIG. 4 , the cavity may be aclosed cavity, and the electronic device 100 may also include an opencavity extending from distal end 422 of the closed cavity, the opencavity fluidly coupled (e.g., via an open portion 404 of the gap 118) toan external environment of the electronic device. As discussed herein inconnection with, for example, FIG. 12 , the electronic device 100 mayalso include an additional resonator 1200 formed in the device housing(e.g., in the housing 106) adjacent the location of the resonator 900,in one or more implementations. As discussed herein in connection with,for example, FIG. 14 , the electronic device 100 may also include abarrier 1400 at a distal end 1406 of the cavity, and the location of theresonator 900 may be adjacent the barrier 1400.

In accordance with one or more implementations, a device such as theelectronic device 100 may include an enclosure (e.g., formed, at leastin part, by the housing 106 and the transparent outer layer 112) havingan opening 114, a microphone module 401 mounted within the enclosureadjacent the opening 114, the microphone module 401 having an actuatablesound-generating component 415 (e.g., a diaphragm) that is offset fromthe opening 114 in the enclosure, and a cavity 208 that runs along aninterior wall 214 of the enclosure in a direction away from the opening114, from a proximal end 420 adjacent the microphone module 401 to adistal end (e.g., the distal end 422 or another distal end such as adistal end coinciding with a physical barrier) within the enclosure, anda resonator 900 for the microphone module 401, the resonator 900 formedin a structure (e.g., the support structure 204 as in the example ofFIG. 11 or in the housing 106 as in the example of FIG. 10 ) of theelectronic device at a location between the proximal end 420 and thedistal end 422 of the cavity, the location spatially separated from themicrophone module 401. In one or more implementations, the cavity is atleast partially defined by a glass housing member (e.g., the transparentouter layer 112) having an edge 210 adjacent the a housing 106 of theenclosure. In one or more implementations, the cavity 208 includes afirst portion that is closed by the housing 106 and the glass housingmember and that extends from the microphone module 401 along theinterior wall 214 of the housing 106, and a second portion extendingfrom the first portion and fluidly coupled to an external environment ofthe electronic device by a gap 118 between the housing 106 and the glasshousing member. In one or more implementations, the enclosure includes astraight portion 120 and a curved portion 122, the first portion of thecavity 208 extends along the straight portion 120 of the enclosure, andthe second portion of the cavity extends along the curved portion 122 ofthe enclosure. In one more implementations, the structure of theelectronic device 100 in which the resonator 900 is formed includes aportion of the housing 106 (e.g., as in the example of FIG. 10 ). In oneor more other implementations, the electronic device 100 includes adisplay module 200 that includes a cover glass layer (e.g., thetransparent outer layer 112) that defines a portion of the cavity, and asupport structure 204, and the structure of the electronic device 100 inwhich the resonator 900 is formed includes a portion of the supportstructure 204 of the display module 200 (e.g., as in the example of FIG.11 ).

FIG. 15 illustrates an electronic system 1500 with which one or moreimplementations of the subject technology may be implemented. Theelectronic system 1500 can be, and/or can be a part of, one or more ofthe electronic device 100 shown in FIG. 1 . The electronic system 1500may include various types of computer readable media and interfaces forvarious other types of computer readable media. The electronic system1500 includes a bus 1508, one or more processing unit(s) 1512, a systemmemory 1504 (and/or buffer), a ROM 1510, a permanent storage device1502, an input device interface 1514, an output device interface 1506,and one or more network interfaces 1516, or subsets and variationsthereof.

The bus 1508 collectively represents all system, peripheral, and chipsetbuses that communicatively connect the numerous internal devices of theelectronic system 1500. In one or more implementations, the bus 1508communicatively connects the one or more processing unit(s) 1512 withthe ROM 1510, the system memory 1504, and the permanent storage device1502. From these various memory units, the one or more processingunit(s) 1512 retrieves instructions to execute and data to process inorder to execute the processes of the subject disclosure. The one ormore processing unit(s) 1512 can be a single processor or a multi-coreprocessor in different implementations.

The ROM 1510 stores static data and instructions that are needed by theone or more processing unit(s) 1512 and other modules of the electronicsystem 1500. The permanent storage device 1502, on the other hand, maybe a read-and-write memory device. The permanent storage device 1502 maybe a non-volatile memory unit that stores instructions and data evenwhen the electronic system 1500 is off. In one or more implementations,a mass-storage device (such as a magnetic or optical disk and itscorresponding disk drive) may be used as the permanent storage device1502.

In one or more implementations, a removable storage device (such as afloppy disk, flash drive, and its corresponding disk drive) may be usedas the permanent storage device 1502. Like the permanent storage device1502, the system memory 1504 may be a read-and-write memory device.However, unlike the permanent storage device 1502, the system memory1504 may be a volatile read-and-write memory, such as random accessmemory. The system memory 1504 may store any of the instructions anddata that one or more processing unit(s) 1512 may need at runtime. Inone or more implementations, the processes of the subject disclosure arestored in the system memory 1504, the permanent storage device 1502,and/or the ROM 1510. From these various memory units, the one or moreprocessing unit(s) 1512 retrieves instructions to execute and data toprocess in order to execute the processes of one or moreimplementations.

The bus 1508 also connects to the input and output device interfaces1514 and 1506. The input device interface 1514 enables a user tocommunicate information and select commands to the electronic system1500. Input devices that may be used with the input device interface1514 may include, for example, microphones, alphanumeric keyboards andpointing devices (also called “cursor control devices”). The outputdevice interface 1506 may enable, for example, the display of imagesgenerated by electronic system 1500. Output devices that may be usedwith the output device interface 1506 may include, for example, printersand display devices, such as a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic light emitting diode (OLED)display, a flexible display, a flat panel display, a solid statedisplay, a projector, a speaker or speaker module, or any other devicefor outputting information. One or more implementations may includedevices that function as both input and output devices, such as atouchscreen. In these implementations, feedback provided to the user canbe any form of sensory feedback, such as visual feedback, auditoryfeedback, or tactile feedback; and input from the user can be receivedin any form, including acoustic, speech, or tactile input.

Finally, as shown in FIG. 15 , the bus 1508 also couples the electronicsystem 1500 to one or more networks and/or to one or more network nodesthrough the one or more network interface(s) 1516. In this manner, theelectronic system 1500 can be a part of a network of computers (such asa LAN, a wide area network (“WAN”), or an Intranet, or a network ofnetworks, such as the Internet. Any or all components of the electronicsystem 1500 can be used in conjunction with the subject disclosure.

In accordance with some aspects of the subject disclosure, a device isprovided that includes a microphone having a front volume and a backvolume; and a resonator for the microphone, the resonator fluidlycoupled to the front volume of the microphone.

In accordance with other aspects of the subject disclosure, a device isprovided that includes a device enclosure; an acoustic componentdisposed within the device enclosure; and a resonator for the acousticcomponent, the resonator formed in a housing of the device enclosure ata location that is spatially separated from the acoustic component.

In accordance with other aspects of the subject disclosure, anelectronic device is provided that includes an enclosure having anopening; a microphone module mounted within the enclosure adjacent theopening, the microphone module having an actuatable sound-generatingcomponent that is offset from the opening in the enclosure; a cavitythat runs along an interior wall of the enclosure in a direction awayfrom the opening from a proximal end adjacent the microphone module to adistal end within the enclosure; and a resonator for the microphonemodule, the resonator formed in a structure of the electronic device ata location between the proximal end and the distal end of the cavity,the location spatially separated from the microphone module.

In accordance with other aspects of the subject disclosure, anelectronic device is provided that includes an enclosure having anopening; a microphone module mounted within the enclosure adjacent theopening, the microphone module having an actuatable sound-generatingcomponent that is offset from the opening in the enclosure; a cavitythat runs along an interior wall of the enclosure in a direction awayfrom the opening, from a proximal end adjacent the microphone module toa distal end; and a damping feature within a portion of the cavity andconfigured to damp an acoustic resonance of the cavity.

In accordance with other aspects of the subject disclosure, anelectronic device is provided that includes an enclosure having anopening and a cover layer; a microphone module mounted within theenclosure adjacent the opening, the microphone module having anactuatable sound-generating component that is offset from the opening inthe enclosure; and a cavity that runs along an interior wall of theenclosure in a direction away from the opening, from a proximal endadjacent the microphone module to a distal end, in which the cover layerpartially defines the cavity and comprises a patterned edge.

In accordance with other aspects of the subject disclosure, anelectronic device is provided that includes a housing; a cover layermounted to the housing; a microphone within the housing; a resonantcavity within the housing, separate from the microphone, andacoustically coupled to the microphone; and a material that at leastpartially fills a portion of the resonant cavity and is configured toameliorate an acoustic resonance of the resonant cavity.

Implementations within the scope of the present disclosure can bepartially or entirely realized using a tangible computer-readablestorage medium (or multiple tangible computer-readable storage media ofone or more types) encoding one or more instructions. The tangiblecomputer-readable storage medium also can be non-transitory in nature.

The computer-readable storage medium can be any storage medium that canbe read, written, or otherwise accessed by a general purpose or specialpurpose computing device, including any processing electronics and/orprocessing circuitry capable of executing instructions. For example,without limitation, the computer-readable medium can include anyvolatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM,and TTRAM. The computer-readable medium also can include anynon-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM,NVRAM, flash, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM,NRAM, racetrack memory, FJG, and Millipede memory.

Further, the computer-readable storage medium can include anynon-semiconductor memory, such as optical disk storage, magnetic diskstorage, magnetic tape, other magnetic storage devices, or any othermedium capable of storing one or more instructions. In one or moreimplementations, the tangible computer-readable storage medium can bedirectly coupled to a computing device, while in other implementations,the tangible computer-readable storage medium can be indirectly coupledto a computing device, e.g., via one or more wired connections, one ormore wireless connections, or any combination thereof.

Instructions can be directly executable or can be used to developexecutable instructions. For example, instructions can be realized asexecutable or non-executable machine code or as instructions in ahigh-level language that can be compiled to produce executable ornon-executable machine code. Further, instructions also can be realizedas or can include data. Computer-executable instructions also can beorganized in any format, including routines, subroutines, programs, datastructures, objects, modules, applications, applets, functions, etc. Asrecognized by those of skill in the art, details including, but notlimited to, the number, structure, sequence, and organization ofinstructions can vary significantly without varying the underlyinglogic, function, processing, and output.

While the above discussion primarily refers to microprocessor ormulti-core processors that execute software, one or more implementationsare performed by one or more integrated circuits, such as ASICs orFPGAs. In one or more implementations, such integrated circuits executeinstructions that are stored on the circuit itself.

Various functions described above can be implemented in digitalelectronic circuitry, in computer software, firmware or hardware. Thetechniques can be implemented using one or more computer programproducts. Programmable processors and computers can be included in orpackaged as mobile devices. The processes and logic flows can beperformed by one or more programmable processors and by one or moreprogrammable logic circuitry. General and special purpose computingdevices and storage devices can be interconnected through communicationnetworks.

Some implementations include electronic components, such asmicroprocessors, storage and memory that store computer programinstructions in a machine-readable or computer-readable medium(alternatively referred to as computer-readable storage media,machine-readable media, or machine-readable storage media). Someexamples of such computer-readable media include RAM, ROM, read-onlycompact discs (CD-ROM), recordable compact discs (CD-R), rewritablecompact discs (CD-RW), read-only digital versatile discs (e.g., DVD-ROM,dual-layer DVD-ROM), a variety of recordable/rewritable DVDs (e.g.,DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD cards, mini-SDcards, micro-SD cards, etc.), magnetic and/or solid state hard drives,ultra density optical discs, any other optical or magnetic media, andfloppy disks. The computer-readable media can store a computer programthat is executable by at least one processing unit and includes sets ofinstructions for performing various operations. Examples of computerprograms or computer code include machine code, such as is produced by acompiler, and files including higher-level code that are executed by acomputer, an electronic component, or a microprocessor using aninterpreter.

While the above discussion primarily refers to microprocessor ormulti-core processors that execute software, some implementations areperformed by one or more integrated circuits, such as applicationspecific integrated circuits (ASICs) or field programmable gate arrays(FPGAs). In some implementations, such integrated circuits executeinstructions that are stored on the circuit itself.

As used in this specification and any claims of this application, theterms “computer”, “processor”, and “memory” all refer to electronic orother technological devices. These terms exclude people or groups ofpeople. For the purposes of the specification, the terms “display” or“displaying” means displaying on an electronic device. As used in thisspecification and any claims of this application, the terms “computerreadable medium” and “computer readable media” are entirely restrictedto tangible, physical objects that store information in a form that isreadable by a computer. These terms exclude any wireless signals, wireddownload signals, and any other ephemeral signals.

Many of the above-described features and applications are implemented assoftware processes that are specified as a set of instructions recordedon a computer readable storage medium (also referred to as computerreadable medium). When these instructions are executed by one or moreprocessing unit(s) (e.g., one or more processors, cores of processors,or other processing units), they cause the processing unit(s) to performthe actions indicated in the instructions. Examples of computer readablemedia include, but are not limited to, CD-ROMs, flash drives, RAM chips,hard drives, EPROMs, etc. The computer readable media does not includecarrier waves and electronic signals passing wirelessly or over wiredconnections.

In this specification, the term “software” is meant to include firmwareresiding in read-only memory or applications stored in magnetic storage,which can be read into memory for processing by a processor. Also, insome implementations, multiple software aspects of the subjectdisclosure can be implemented as sub-parts of a larger program whileremaining distinct software aspects of the subject disclosure. In someimplementations, multiple software aspects can also be implemented asseparate programs. Finally, any combination of separate programs thattogether implement a software aspect described here is within the scopeof the subject disclosure. In some implementations, the softwareprograms, when installed to operate on one or more electronic systems,define one or more specific machine implementations that execute andperform the operations of the software programs.

A computer program (also known as a program, software, softwareapplication, script, or code) can be written in any form of programminglanguage, including compiled or interpreted languages, declarative orprocedural languages, and it can be deployed in any form, including as astand alone program or as a module, component, subroutine, object, orother unit suitable for use in a computing environment. A computerprogram may, but need not, correspond to a file in a file system. Aprogram can be stored in a portion of a file that holds other programsor data (e.g., one or more scripts stored in a markup languagedocument), in a single file dedicated to the program in question, or inmultiple coordinated files (e.g., files that store one or more modules,sub programs, or portions of code). A computer program can be deployedto be executed on one computer or on multiple computers that are locatedat one site or distributed across multiple sites and interconnected by acommunication network.

It is understood that any specific order or hierarchy of blocks in theprocesses disclosed is an illustration of example approaches. Based upondesign preferences, it is understood that the specific order orhierarchy of blocks in the processes may be rearranged, or that allillustrated blocks be performed. Some of the blocks may be performedsimultaneously. For example, in certain circumstances, multitasking andparallel processing may be advantageous. Moreover, the separation ofvarious system components in the implementations described above shouldnot be understood as requiring such separation in all implementations,and it should be understood that the described program components andsystems can generally be integrated together in a single softwareproduct or packaged into multiple software products.

The previous description is provided to enable any person skilled in theart to practice the various aspects described herein. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother aspects. Thus, the claims are not intended to be limited to theaspects shown herein, but are to be accorded the full scope consistentwith the language claims, wherein reference to an element in thesingular is not intended to mean “one and only one” unless specificallyso stated, but rather “one or more.” Unless specifically statedotherwise, the term “some” refers to one or more. Pronouns in themasculine (e.g., his) include the feminine and neuter gender (e.g., herand its) and vice versa. Headings and subheadings, if any, are used forconvenience only and do not limit the subject disclosure.

The predicate words “configured to”, “operable to”, and “programmed to”do not imply any particular tangible or intangible modification of asubject, but, rather, are intended to be used interchangeably. Forexample, a processor configured to monitor and control an operation or acomponent may also mean the processor being programmed to monitor andcontrol the operation or the processor being operable to monitor andcontrol the operation. Likewise, a processor configured to execute codecan be construed as a processor programmed to execute code or operableto execute code.

A phrase such as an “aspect” does not imply that such aspect isessential to the subject technology or that such aspect applies to allconfigurations of the subject technology. A disclosure relating to anaspect may apply to all configurations, or one or more configurations. Aphrase such as an aspect may refer to one or more aspects and viceversa. A phrase such as a “configuration” does not imply that suchconfiguration is essential to the subject technology or that suchconfiguration applies to all configurations of the subject technology. Adisclosure relating to a configuration may apply to all configurations,or one or more configurations. A phrase such as a configuration mayrefer to one or more configurations and vice versa.

The word “example” is used herein to mean “serving as an example orillustration.” Any aspect or design described herein as “example” is notnecessarily to be construed as preferred or advantageous over otheraspects or design.

In one aspect, a term coupled or the like may refer to being directlycoupled. In another aspect, a term coupled or the like may refer tobeing indirectly coupled.

Terms such as top, bottom, front, rear, side, horizontal, vertical, andthe like refer to an arbitrary frame of reference, rather than to theordinary gravitational frame of reference. Thus, such a term may extendupwardly, downwardly, diagonally, or horizontally in a gravitationalframe of reference.

All structural and functional equivalents to the elements of the variousaspects described throughout this disclosure that are known or latercome to be known to those of ordinary skill in the art are expresslyincorporated herein by reference and are intended to be encompassed bythe claims. Moreover, nothing disclosed herein is intended to bededicated to the public regardless of whether such disclosure isexplicitly recited in the claims. No claim element is to be construedunder the provisions of 35 U.S.C. § 112(f), unless the element isexpressly recited using the phrase “means for” or, in the case of amethod claim, the element is recited using the phrase “step for.”Furthermore, to the extent that the term “include,” “have,” or the likeis used in the description or the claims, such term is intended to beinclusive in a manner similar to the term “comprise” as “comprise” isinterpreted when employed as a transitional word in a claim.

What is claimed is:
 1. An electronic device, comprising: an enclosurehaving an opening; a microphone module mounted within the enclosureadjacent the opening, the microphone module having an actuatablesound-generating component that is offset from the opening in theenclosure; a cavity that runs along an interior wall of the enclosure ina direction away from the opening, from a proximal end adjacent themicrophone module to a distal end; and a damping feature within aportion of the cavity and configured to damp an acoustic resonance ofthe cavity.
 2. The electronic device of claim 1, wherein the dampingfeature comprising a damping material within the portion of the cavity.3. The electronic device of claim 2, wherein the damping materialcomprises a foam in the portion of the cavity.
 4. The electronic deviceof claim 2, wherein the damping material comprises a thickened portionof a housing of the enclosure.
 5. The electronic device of claim 2,wherein the damping material comprises an extension member on aninterior component of the electronic device.
 6. The electronic device ofclaim 2, wherein the microphone module is mounted adjacent a straightportion of the enclosure, and wherein the cavity runs along the interiorwall to a curved portion of the enclosure.
 7. The electronic device ofclaim 6, wherein the enclosure comprises a housing and a cover glass,the electronic device further comprising an open cavity that runs alongan interior wall of the curved portion of the enclosure and that isfluidly coupled to the cavity at a location within the enclosure andfluidly coupled to an external environment of the electronic device viaa gap between the cover glass and the housing.
 8. An electronic device,comprising: an enclosure having an opening and a cover layer; amicrophone module mounted within the enclosure adjacent the opening, themicrophone module having an actuatable sound-generating component thatis offset from the opening in the enclosure; and a cavity that runsalong an interior wall of the enclosure in a direction away from theopening, from a proximal end adjacent the microphone module to a distalend, wherein the cover layer partially defines the cavity and comprisesa patterned edge.
 9. The electronic device of claim 8, wherein theenclosure further comprises a housing of the electronic device, andwherein the patterned edge of the cover layer is adjacent an edge of thehousing.
 10. The electronic device of claim 9, wherein the patternededge of the cover layer comprises at least one peak and at least onevalley.
 11. The electronic device of claim 10, wherein the at least onepeak, when moved into contact with the edge of the housing, prevents theat least one valley from contacting the edge of the housing so that agap between the at least one valley and the edge of the housing fluidlycouples the cavity to an external environment of the electronic device.12. The electronic device of claim 11, wherein the cover layer comprisesa cover glass layer.
 13. The electronic device of claim 8, wherein themicrophone module is mounted adjacent a straight portion of theenclosure, and wherein the cavity runs along the interior wall to acurved portion of the enclosure.
 14. An electronic device, comprising: ahousing; a cover layer mounted to the housing; a microphone within thehousing; a resonant cavity within the housing, separate from themicrophone, and acoustically coupled to the microphone; and a materialthat at least partially fills a portion of the resonant cavity and isconfigured to ameliorate an acoustic resonance of the resonant cavity.15. The electronic device of claim 14, wherein the material comprises afoam in the portion of the resonant cavity.
 16. The electronic device ofclaim 14, wherein the material comprises a thickened portion of thehousing.
 17. The electronic device of claim 14, wherein the materialcomprises an extension member on an interior component of the electronicdevice.
 18. The electronic device of claim 17, wherein the interiorcomponent comprises a support structure of a display module.
 19. Theelectronic device of claim 14, wherein the microphone is mountedadjacent a straight portion of the housing, and wherein the cavity runsalong an interior wall of the housing to a curved portion of thehousing.
 20. The electronic device of claim 19, wherein a gap, betweenthe cover layer and the housing, fluidly couples the resonant cavity toan external environment of the electronic device.